Rf and microwave microelectronics packaging ii
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It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis
Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies
Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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Taal: en
Bindwijze: Paperback
Oorspronkelijke releasedatum: 09 juni 2018
Aantal pagina's: 172
Illustraties: Nee
Hoofdauteur: Kuang, Ken
Hoofdredacteur: Ken Kuang
Tweede Redacteur: Rick Sturdivant
Hoofduitgeverij: Springer International Publishing Ag
Editie: Softcover reprint of the original 1st ed. 2017
Extra groot lettertype: Nee
Product breedte: 155 mm
Product lengte: 235 mm
Studieboek: Nee
Verpakking breedte: 155 mm
Verpakking hoogte: 235 mm
Verpakking lengte: 235 mm
Verpakkingsgewicht: 2934 g
EAN: 9783319847191