Wireless cortical implantable systems

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Wireless Cortical Implantable Systems examines the design for data acquisition and transmission in cortical implants. The second part of the book focuses on system-level as well as circuit and system level solutions to the development of ultra low-power and low-noise microelectronics for cortical implants.

Wireless Cortical Implantable Systems examines the design for data acquisition and transmission in cortical implants. The first part of the book covers existing system-level cortical implants, as well as future devices. The authors discuss the major constraints in terms of microelectronic integration. The second part of the book focuses on system-level as well as circuit and system level solutions to the development of ultra low-power and low-noise microelectronics for cortical implants. Existing solutions are presented and novel methods and solutions proposed. The third part of the book focuses on the usage of digital impulse radio ultra wide-band transmission as an efficient method to transmit cortically neural recorded data at high data-rate to the outside world. Original architectural and circuit and system solutions are discussed.

Wireless Cortical Implantable Systems examines the design for data acquisition and transmission in cortical implants. The first part of the book covers existing system level cortical implants, as well as future devices. The authors discuss the major constraints in terms of microelectronic integrations are presented. The second part of the book focuses on system-level as well as circuit and system level solutions to the development of ultra low-power and low-noise microelectronics for cortical implants. Existing solutions are presented and novel methods and solutions proposed. The third part of the book focuses on the usage of digital impulse radio ultra wide band transmission as an efficient method to transmit cortically neural recorded data at high data rate to the outside world. Original architectural and circuit and system solutions are discussed.

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Taal: en

Bindwijze: Hardcover

Oorspronkelijke releasedatum: 20 maart 2013

Aantal pagina's: 224

Illustraties: Nee

Hoofdauteur: Vahid Majidzadeh Bafar

Tweede Auteur: Alexandre Schmid

Co Auteur: Alexandre Schmid

Hoofduitgeverij: Springer-Verlag New York Inc.

Editie: 2013

Extra groot lettertype: Nee

Product breedte: 162 mm

Product hoogte: 20 mm

Product lengte: 246 mm

Studieboek: Ja

Verpakking breedte: 162 mm

Verpakking hoogte: 20 mm

Verpakking lengte: 246 mm

Verpakkingsgewicht: 450 g

EAN: 9781461467014

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